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In_xGa_{1-x}Sb MOSFET: Performance Analysis by Self Consistent CV Characterization and Direct Tunneling Gate Leakage Current

机译:In_xGa_ {1-x} sb mOsFET:自洽CV的性能分析   表征和直接隧道栅漏电流

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摘要

In this paper, Capacitance-Voltage (C-V) characteristics and direct tunneling(DT) gate leakage current of antimonide based surface channel MOSFET wereinvestigated. Self-consistent method was applied by solving coupledSchr\"odinger-Poisson equation taking wave function penetration and straineffects into account. Experimental I-V and gate leakage characteristic forp-channel InxGa1-xSb MOSFETs are available in recent literature. However, aself- consistent simulation of C-V characterization and direct tunneling gateleakage current is yet to be done for both n- channel and p-channel InxGa1-xSbsurface channel MOSFETs. We studied the variation of C-V characteristics andgate leakage current with some important process parameters like oxidethickness, channel composition, channel thickness and temperature for n-channelMOSFET in this work. Device performance should improve as compressive strainincreases in channel. Our simulation results validate this phenomenon asballistic current increases and gate leakage current decreases with theincrease in compressive strain. We also compared the device performance byreplacing InxGa1-xSb with InxGa1-xAs in channel of the structure. Simulationresults show that performance is much better with this replacement.
机译:本文研究了基于锑的表面沟道MOSFET的电容-电压(C-V)特性和直接隧穿(DT)栅极漏电流。通过考虑波函数的穿透和应变效应,通过求解耦合的Schr \“ odinger-Poisson方程来应用自洽方法。最近的文献中提供了用于p沟道InxGa1-xSb MOSFET的实验IV和栅极泄漏特性。 n沟道和p沟道InxGa1-xSb表面沟道MOSFET的CV表征和直接隧穿栅极漏电流尚待完成,我们研究了氧化物特性,沟道组成,沟道厚度等重要工艺参数对CV特性和栅极漏电流的影响。 n沟道MOSFET的温度和温度。器件的性能应随沟道中压缩应变的增加而改善。我们的仿真结果验证了这种现象,随压缩应变的增加弹道电流增加而栅极漏电流减小。我们还通过替换InxGa1-xSb来比较器件性能在通道的InxGa1-xAs中结构。仿真结果表明,这种替代方法的性能要好得多。

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